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94 V0 1.25W/MK Thermal Gap Pad 0.25-5.0mmT For High Speed Mass Storage Drives

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Dongguan Ziitek Electronical Material and Technology Ltd.

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94 V0 1.25W/MK Thermal Gap Pad 0.25-5.0mmT For High Speed Mass Storage Drives

Name: 94 V0 125WMK Thermal Gap Pad 02550mmT For High Speed Mass Storage Drives
Brand: Ziitek
Price: 0.1 USD

Quality 94 V0 1.25W/MK Thermal Gap Pad 0.25-5.0mmT For High Speed Mass Storage Drives for sale

Brand Name : Ziitek

Model Number : TIF2100-01U Series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*23*12cm cantons

color : Grey/White

Thickness : 0.25-5.0mmT

Specific Gravity : 2.20 g/cc

Dielectric Breakdown Voltage : >5000 VAC

Thermal conductivity : 1.25W/m-K

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low cost 94 V0 1.25W/MK thermal gap pad 0.25-5.0mmT for High speed mass storage drives

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

The TIF2100-01U Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF2100-01U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

TIF200-01U Series Datasheet-(E)-REV01.pdf

Features
> Good thermal conductive: 1.25W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance

Applications

> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> routers
> Telecommunication hardware

Typical Properties of TIF2100-01U Series
Color	Grey/White	Visual	Composite Thickness	Thermal Impedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific Gravity	2.20g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness range	0.010"-0.200"	ASTM C351	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	25 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Dielectric Breakdown Voltage	>5000 VAC	ASTM D412	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Outgassing(TML)	0.55%	ASTM E595	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	5.5 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	4.0X10" Ohm-meter	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	1.25W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

Standard Sheets Sizes:

0.010-inch to 0.200-inch(0.25mm to 5.0mm)

TIF™ series Individual die cut shapes can be supplied.

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

94 V0 1.25W/MK Thermal Gap Pad 0.25-5.0mmT For High Speed Mass Storage Drives

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

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94 V0 1.25W/MK Thermal Gap Pad 0.25-5.0mmT For High Speed Mass Storage Drives

94 V0 1.25W/MK Thermal Gap Pad 0.25-5.0mmT For High Speed Mass Storage Drives

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