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High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions

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High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions

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Brand Name : Ziitek

Model Number : TIC805G

Certification : RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-6 work days

Packaging Details : 24*23*12cm

Name : High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions

Color : Gray

Keyword : Phase Change Materials

Feature : Low melting point

Thermal conductivity : 5W/mK

Applicatoin : Memory Modules

Density : 2.6 g/cc

Temperature range : -40℃～125℃

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High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.


The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

TIC800G Series Datasheet-(E)-REV01.pdf

High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions


Features


> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required


Applications


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Typical Properties of TICTM800G Series
Product Name TICTM805G TICTM808G TICTM810G TICTM812G Test Method
Color Gray Gray Gray Gray Visual
Thickness 0.005" 0.008" 0.010" 0.012" ****
(0.127mm) (0.203mm) (0.254mm) (0.305mm)
Thickness Tolerance ±0.0005'' ±0.0008'' ±0.0010'' ±0.0012'' ****
(±0.127mm) (±0.203mm) (±0.0254mm) (±0.0305mm)
Density 2.6g/cc Helium Pycnometer
Temperature range -40℃～125℃ ****
Phase Change Softening Temperature 50℃~60℃ ****
Thermal Conductivity 5.0 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa) 0.014℃-in²/W 0.020℃-in²/W 0.038℃-in²/W 0.058℃-in²/W ASTM D5470 (modified)
0.09℃-cm²/W 0.13℃-cm²/W 0.25℃-cm²/W 0.37℃-cm²/W

Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)

Consult the factory alternate thickness.

Standard Sizes:
10" x 16"(254mm x 406mm) 16" x 400'(406mm x 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800G series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800G series products.

Reinforcement:
No reinforcement is necessary.

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions

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Product Tags:

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